Huawei Unveils Multi-Year Roadmap for Ascend AI Chips
At its HUAWEI CONNECT conference, the company detailed plans for three new chip series and a new data center solution to challenge Western dominance.
At its HUAWEI CONNECT 2025 conference in Shanghai, Chinese technology firm Huawei detailed an ambitious, vertically integrated hardware strategy, including a multi-year plan for its Ascend line of AI processors. The announcements, made between September 18-20, signal a direct challenge to the market dominance of Western semiconductor firms and a strategic push for technological self-sufficiency.
## A Challenge to Western Dominance
Huawei Chairman Eric Xu announced a roadmap for three new series of Ascend chips: the 950, 960, and 970, slated for release in 2026, 2027, and 2028, respectively. Xu stated the company would follow a one-year release cycle …
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