Purdue and Argonne Lab Use AI to Find Semiconductor Defects
A new collaboration is developing a faster, nondestructive technique using high-resolution imaging and AI to identify minuscule chip flaws.
A New Approach to Quality Control
A new collaboration between Purdue University and Argonne National Laboratory is developing a faster, nondestructive technique to find minuscule defects in semiconductor chips. The research, detailed on Oct. 6, 2025, uses high-resolution imaging and artificial intelligence-driven analysis to identify flaws that could cripple electronic devices, from a car's steering to a laptop's security.
The project is led by Nikhilesh Chawla, Purdue's Ransburg Professor in Materials Engineering and an expert in four-dimensional materials science. The research is supported by the National Science Foundation's Future of Semiconductors program and is part of a broader effort …
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